Seeing is believing: imaging and visualization capabilities of the iTero Element 5D Imaging System are designed to enable better patient engagement and lead to increased patient acceptance of ...

Broadcom Inc. has unveiled its revolutionary 3.5D eXtreme Dimension System in Package (XDSiP) platform, designed to empower consumer AI companies in developing advanced custom accelerators, or XPUs.

Broadcom Inc. today detailed a new chip packaging technology, XDSiP, that makes it possible to create processors by stacking multiple silicon dies atop another. XDSiP is short for eXtreme Dimension ...

The technology is what is known as five-dimensional (5)D optical storage and it is one the University of Southampton team has been pursuing for a while. It was first demonstrated back in 2013, with ...

Broadcom has introduced its 3.5D eXtreme Dimension System in Package (3.5D XDSiP) platform for ultra-high-performance processors for AI and HPC workloads. The new platform relies on TSMC's CoWoS and ...

Broadcom (AVGO) announced the availability of its 3.5D eXtreme Dimension System in Package platform technology, enabling consumer AI customers to develop next-generation custom accelerators. The 3.5D ...

A frenzied crowd of young country music fans explodes in cheers and applause as singer Gary Allan strides onstage at Chicago’s House of Blues. Crisp, film-like close-ups of Allan and his band are ...

MILPITAS, Calif.--(BUSINESS WIRE)--At next week’s 50th Design Automation Conference (DAC) in Austin, Texas, GLOBALFOUNDRIES will unveil a comprehensive set of certified design flows to support 2.5D IC ...

Daredevils can now take a brave walk over a glass skywalk in southwest China which features 5D technologies and a range of special effects.The attraction, located in the well-known tourist destination ...

A*STAR Institute of Microelectronics (IME) has launched the 2.5D Through-Silicon Interposer (TSI) Consortium to accelerate market adoption of TSI technology, which is driven by strong demands in ...