QPT just filed a patent for the “qAttach” process, a novel way to attach dies to heat spreaders or substrates (typically aluminum nitride (AlN)) that significantly reduces thermal resistance. The new ...
The power electronics industry is facing a problem in that, as the power handled by transistors increases to meet the needs of new applications, the packaging will increasingly struggle to remove the ...
Die attach materials form the cornerstone of reliable power electronic packaging, providing the essential bond between semiconductor devices and their substrates. Recent advances have focused on ...
SINGAPORE--(BUSINESS WIRE)--Kulicke & Soffa Industries, Inc. (NASDAQ: KLIC) (“Kulicke & Soffa”, “K&S” or the “Company”), announced it has received a new order of its high-performance die attach ...
New York, Aug. 25, 2021 (GLOBE NEWSWIRE) -- Reportlinker.com announces the release of the report "Die Attach Machine Market by Type, Technique, and Application : Global Opportunity Analysis and ...
DUBLIN--(BUSINESS WIRE)--The "Die Attach Equipment - Global Market Outlook (2018-2027)" report has been added to ResearchAndMarkets.com's offering. The Global Die Attach Equipment market is expected ...
It seems that Report Ocean has published a market research report on the Die-Attach Machine industry, covering over 150 countries and analyzing more than 1,00000 published and forthcoming reports ...
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