Wire bonding is widely used in electronic devices, the semiconductor industry, and microelectronics. It enables interconnections between the die and other electronic components in an integrated ...

Recently, my colleague Robert Ruiz described a new approach to scan test that utilizes the high-speed I/O (HSIO) ports that exist on most chips. The benefits of this new approach include reduced test ...

Rapidly increasing chip and package complexity, coupled with an incessant demand for more reliability, has triggered a frenzy of alliances and working relationships that are starting to redefine how ...

Accurately estimating the junction temperature of a semiconductor device is essential for ensuring its reliability, performance, and longevity. Junction temperature has a direct influence on the ...

A complete test plan includes testing the logic and all memories. That is, until the boss adds, “Oh, by the way, the DFT guy left the company, so you also get to do the test stuff. Choose any tools ...

The purpose of the project is to simply identify and test the condition of digital IC if it is good or defective. An IC tester can be applied to any type of digital ICs. There are some provisions that ...