As the relatively mature wire-bonding technology continues to advance, it has become fully suitable for processing automotive silicon-based IGBT modules, and SiC (silicon carbide) power modules and is ...

DUBLIN--(BUSINESS WIRE)--Research and Markets has announced the addition of the "Infineon CooliR²Die Power Module: Teardown Analysis" report to their offering. The CooliR²Die innovative power module ...

TOKYO--(BUSINESS WIRE)--Mitsubishi Electric Corporation (TOKYO: 6503) announced today that beginning February 15 it will provide samples of its new LV100-type 1.2-kV IGBT module as an industrial-use ...

Infineon Technologies AG launches its new EconoDUALT 3 IGBT modules, which are fully qualified according to automotive standards. Infineon Technologies AG launches its new EconoDUALT 3 IGBT modules, ...

Dissipated heat in a junction is one of the major effects that can influence the reliability of die-attach materials used in an IGBT’s chip. Power cycling tests are ideal to mimic the lifecycle of a ...

Press-Pack Insulated Gate Bipolar Transistors (IGBTs) represent a robust class of semiconductor devices optimised for high-power applications. Unlike conventional IGBT modules that utilise wire ...