The shift to 5G wireless networks is driving a need for new IC packages and modules in smartphones and other systems, but this move is turning out to be harder than it looks. For one thing, the IC ...
New CC2340 Series Family — CC2340R5 Bluetooth 5.3 Low Energy Modules RF-BM-2340B1I, RF-BM-2340A2, RF-BM-2340A2I and RF-BM-2340C2 Are In Stock Now! SHENZHEN ...
Insight SIP, the specialist in ultra-miniature RF modules, is launching the ISP2554-HM module. This module represents a dynamic IOT node, with support for Bluetooth Low Energy, Thread, and Zigbee ...
Module technology, including system-in-a-package (SiP) and multi-chip modules (MCMs), is creating attractive alternatives to the system-on-a-chip (SoC) design methodology for systems that require ...
Rising demand for chips is hitting the IC packaging supply chain, causing shortages of select manufacturing capacity, various package types, leadframes and even some equipment. Spot shortages for some ...
Next-generation RF to millimeter-wave silicon MMIC and module product development software Cadence is excited to announce the launch of its latest RF design and analysis platform, Virtuoso Studio RF.
Operating from 50-Hz to 7-MHz received frequencies, the MSRFIF RF-interface front-end IC runs at 5-kbps upconverting and 120-kbps downconverting data rates. The device suits remote medical sensing, ...
Apple reportedly will continue developing its own mmWave AiP (antenna in package) modules for its next-generation iPhone lineup, with related efforts likely to push the US handset brand moving forward ...
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