The reliability of 3D-IC designs is dependent upon the ability of engineering teams to control heat, which can significantly degrade performance and accelerate circuit aging. While heat has been ...

Design engineers are increasingly turning to 3D ICs to keep pace with the ascent of next-generation AI scaling.

As the semiconductor industry continues its relentless march towards smaller process nodes and more complex integrated circuits (ICs), the challenge of ensuring reliability has become increasingly ...

MUNICH--(BUSINESS WIRE)--Cadence Design Systems, Inc. (NASDAQ: CDNS) today introduced the Cadence ® Legato™ Reliability Solution, the industry’s first software product that meets the challenges of ...

Hi folk, I’ve been in hunkered down mode for the last few weeks researching and writing my next cover story. This one’s on IC reliability. It’s a subject I haven’t tackled before and quite frankly is ...

PITTSBURGH, Nov. 16, 2023 /PRNewswire/ -- Ansys (NASDAQ: ANSS) has collaborated with TSMC and Microsoft to validate a joint solution for analyzing mechanical stresses in multi-die 3D-IC systems ...

The InnoSwitch3-AQ IC, featuring a 1700 V silicon-carbide (SiC) switch, is an ideal solution for 800 V vehicles, simplifying manufacturing while enhancing overall system performance and reliability.

NBTI degradation is critical for chip processes using thermal-nitride gate insulators”which are now at such thicknesses that NBTI effects can prevent a chip designer from relying on the expected ...

Performance of InnoSwitch™3-AQ flyback IC demonstrated in new reference designs featuring wide-creepage package The InnoSwitch3-AQ IC, featuring a 1700 V silicon-carbide (SiC) switch, is an ideal ...