Engineers often consider thermal management and cooling as a two-part problem. First, there’s the global “macro” case where no individual component is excessively hot, but the aggregate heat buildup ...

Passive thermal control relies on design features and materials like insulation layers, reflective coatings, and thermal barriers. Because passive solutions have no moving parts, they require less ...

Heat has emerged as a major concern for semiconductors in every form factor, from digital watches to data centers, and it is becoming more of a problem at advanced nodes and in advanced packages where ...

At advanced nodes and in the most advanced packages, physics is no one’s friend. Escalating density, smaller features, and thinner dies make it more difficult to dissipate heat, and they increase ...

Version 3.0 of Flomerics'(www.flomerics.com) Flo/PCB thermal simulation software helps solve thermal problems in solder reflow processing associated with the use of lead-free solders. In particular, ...