Research and Markets has announced the addition of the "Interposer and Fan-Out WLP Market - Global Forecast to 2022" report to their offering. The interposer and fan-out WLP market has entered the ...

LONDON--(BUSINESS WIRE)--The global fan-out wafer level packaging (FOWLP) market is expected to post a CAGR of almost 16% during the period 2019-2023, according to the latest market research report by ...

Recognizing the strategic importance of semiconductor packaging technology, the South Korean government is reportedly initiating a major packaging technology R&D project aimed at assisting companies ...

Ottawa, Dec. 15, 2025 (GLOBE NEWSWIRE) -- The global advanced packaging market reported a value of USD 40.34 billion in 2025, and according to estimates, it will reach USD 78.75 billion by 2034, as ...

Advanced Chip Engineering (ACE), a wafer-level packaging and testing house which has investment from King Yuan Electronics Company (KYEC), suffered a fire on the second floor of a... STATS ChipPAC has ...

ANAHEIM, Calif.-Semiconductor packaging at the wafer-level is here today, and a lot more is on the way. That's the word from leading developers of the technology still working on key technical hurdles ...

Better performance and lower cost are always key trends being pursued in the semiconductor industry. Moore’s law has provided a very well-defined relationship between performance and cost and the ...

Heidelberg, Germany – Heidelberg Instruments, a global player in direct write technology and solution provider for the advanced packaging market, is transforming the semiconductor industry with its ...