Chicago, Dec. 11, 2025 (GLOBE NEWSWIRE) -- The global wafer dicing services market was valued at US$ 617.5 million in 2025 and is projected to exceed valuation of US$ 932.9 million by 2035 at a CAGR ...

LONDON--(BUSINESS WIRE)--The wafer dicing saws market will witness an incremental growth of USD 95.94 million during 2020-2024, according to the latest pandemic recovery-based research report by ...

The demand for consistently high electrical performance in the power discrete semiconductor market has driven component developers to continuously enhance ...

LONDON--(BUSINESS WIRE)--The global wafer dicing saws market size is poised to grow by USD 95.94 million during 2020-2024, progressing at a CAGR of almost 3% throughout the forecast period, according ...

Increasing the yield of wafers is one way to attack the current global chip shortage. One possibility to reduce losses is a laser processing method called wafer stealth dicing. Here, laser power is ...

How Does Fonon BlackStar Maximize Wafer Dicing Yield? Fonon Corporation’s laser-powered BlackStar Wafer Dicing System helps semiconductor fabricators eliminate defects, distortions, cracks and ...

Advances in laser grooving means that manufacturers are able to optimize die separation quality by combining traditional blade dicing and laser grooving techniques to separate individual chips from ...

Lasers play a crucial role in various applications in semiconductor manufacturing, such as laser cutting and slicing. The integration of lasers enhances throughput and improves defect control, leading ...

Taking place at the end of the semiconductor process flow, dicing is the process where the silicon wafer is finally turned into individual chips, or die, traditionally by means of a saw or laser. A ...

Germany-based engineering company Lidrotec has developed a novel laser dicing process alongside Trumpf, which has helped to scale the process for mass production of wafers using its laser and beam ...