Extensive Array of Back-End and Advanced Packaging Wet Wafer Process Equipment Leverages ACM’s Experience to Address Emerging Requirements for Wafer-Level Packaging FREMONT, Calif., Oct. 15, 2020 ...

San Francisco —Competing industry teams are racing to develop wafer-level packaging (WLP) as front- and backend semiconductor manufacturing and assembly technologies converge in the advanced packaging ...

SAN JOSE, Calif. — Citing renewed demand, Singapore's STATS ChipPAC Ltd. is expanding its capacity for wafer-level packaging. STATS ChipPAC has been on a production ramp with wafer-level packaging ...

FREMONT, Calif., Sept. 04, 2024 (GLOBE NEWSWIRE) -- ACM Research, Inc. (ACMR) (“ACM”) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level ...

FREMONT, Calif., May 08, 2024 (GLOBE NEWSWIRE) -- ACM Research, Inc. (ACMR) (“ACM”) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level ...

Samsung Electronics has stepped up its deployment in the fan-out (FO) wafer-level packaging segment with plans to set up related production lines in Japan, according to industry sources. Samsung has ...

This study investigates creation of 1.0µm RDL structures by a damascene process utilizing a photosensitive permanent dielectric material. The advantage of the photosensitive dielectric approach is ...

CONCORD, Calif.--(BUSINESS WIRE)--Nordson MARCH, a division of Nordson (NASDAQ:NDSN), a global leader in plasma processing technology, will present the paper, "Plasma Applications for Wafer Level ...

Recognizing the strategic importance of semiconductor packaging technology, the South Korean government is reportedly initiating a major packaging technology R&D project aimed at assisting companies ...

TSMC has continued to ramp up investment in advanced packaging. According to Commercial Times, alongside its transition to a ...