Researchers from China's Shandong University have proposed a new methodology for the quantitative prediction of excess kerf loss caused by lateral vibration of diamond wire wafer cutting in solar ...
Diamond wire sawing is a critical cutting technology in the semiconductor and photovoltaic industries, employed to slice single-crystal silicon ingots into thin wafers. The process utilises a ...
– SCHMID accompanies production change-over and takes care of downstream processes. The wafers of the future are getting thinner and thinner and already approaching a thickness of 140 µm. The slurry ...
Product Briefing Outline: Due to technology partnerships and longtime experience RENA has been able to optimize the handling and process sequence for the complete process chain after wafer sawing with ...
The complete wafer saw solution includes: DISCO’s fully automatic dicing saw for high-throughput, dual-cut processing, DISCO’s ablation laser saw and stealth dicing saw, Rudolph’s NSX ® inspection ...
News Applied Materials withdraws from solar ion implant and wafer sawing sectors By Mark Osborne August 19, 2015 Cell Processing, Financial & Legal, Manufacturing, Markets & Finance, Power Plants, ...
Dr. Davor Sutija is the CEO of NexWafe, a solar photovoltaic company establishing a new standard for the future of engineered green wafers. With the advent of the United States’ first-ever clean ...
A new process for cutting silicon wafers could streamline the production of smaller and more powerful microchips for electronic devices. A new process for cutting silicon wafers could streamline the ...
Semiconductors guarantee high resistance, low cost, and reliability when used in electronic circuits. To manufacture semiconductor devices, multiple photographic and chemical-processing steps are ...
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