Moore’s Law has shifted toward advanced packaging over the past few years, but the limits of that approach are just now coming into focus. AI and HPC designs are growing larger ...
Liquid cooling is proving effective at cooling high-power chips, such as GPUs, but it’s creating thermal issues for other nearby chips that previously benefited from the airflow ...
Based CPU-GPU Architecture with Replay-Driven Simulation and Emulation,” was published by researchers at Intel, Nvidia and ...
As ATE systems become increasingly complex and data-intensive, traditional rule-based optimization methods struggle to keep ...
Inferencing at the edge has very different needs than training large language models or large-scale inferencing in AI data ...
Analysis of the Evolving Landscape of Ultra-low-power Edge AI Processors (U. of Austria, ETH Zurich)
A new technical paper, “Performance Analysis of Edge and In-Sensor AI Processors: A Comparative Review,” was published by University of Austria and ETH Zurich. Abstract “This review examines the ...
AI data centers are starting to replace copper with co-packaged optics in an effort to reduce energy consumed per bit and ...
A new technical paper, “Towards Structured Training and Validation of AI-based Systems with Digital Twin Scenarios,” was ...
But now, with this new platform, we can create thousands of individually controllable laser beams that can interact with the ...
UALink data exchange and control; AI sovereignty; 3D-IC thermal behavior; UART security; SystemVerilog coverage extensibility.
AI workloads require rapid access to vast amounts of data, made possible by integrating HBMs. This approach, combining two, ...
A new technical paper, “Oxide induced degradation in MoS2 field-effect transistors,” was published by researchers at imec and ETH Zurich. Abstract excerpt “Transition Metal Dichalcogenides (TMDC) are ...
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