Micron Technology is investing $7 billion to build an advanced chip packaging facility in Singapore as the semiconductor giant expands its capacity to cater to booming demand for AI chips.

The US semiconductor company has commenced construction on a new high-bandwidth memory advanced packaging facility.

It's Singapore's first facility dealing with HBM, part of the AI chips that's powering companies like Nvidia and TSMC to new heights.

Micron Technology, Inc. (NASDAQ:MU) broke ground on a new High-Bandwidth Memory (HBM) advanced packaging facility near the company’s current facilities in Singapore. It marks Singapore’s first HBM advanced packaging facility,

Operations are scheduled to start in 2026 with the expansion of packaging capacity beginning in 2027. Read more at straitstimes.com.

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Artificial intelligence technology has been a major driver of the bull market over the past couple of years. Technology firms, especially the

The main piece of news driving Micron stock higher was that Nvidia will be using Micron's high-bandwidth-memory (HBM) in its new GeForce RTX 50 Blackwell GPUs that undergird its new advanced AI platform.

Micron Technology Inc. is investing $7 billion over the next several years to expand its manufacturing footprint in Singapore, as artificial intelligence boosts demand for advanced memory chips.

Mizuho analysts project a positive 2025 for chipmakers, supported by robust artificial intelligence (AI) demand, data center expansion, and advancements in networking and memory chips. This optimism persists

Bull markets are often built on themes, and it’s clear which one has been driving the current one’s gains. It’s all about AI, of course, with the