Abstract: This paper describes the three-dimensional structure of a single-sided cooling power module that uses a lead frame as a heat conduction path to cool power semiconductor dies on both sides.
The FileMaker Apache Commons JAR Replacer is an automation solution that addresses CVE-2025-46295 by replacing vulnerable Apache Commons JAR files in FileMaker Server installations. Instead of ...
Abstract: In this study, the thermal characteristics and structure reliability during power cycling for the four types of SiC power module fabricated using a SiC-heater chip, direct bonded aluminum ...
We introduce VeriStruct, a novel framework that extends AI-assisted automated verification from single functions to more complex data structure modules in Verus. VeriStruct employs a planner module to ...
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